(西安理工大學(xué) 材料科學(xué)與工程學(xué)院，西安 710048)
摘 要: 采用座滴法研究在真空和Ar氣氣氛下，Cu-Fe合金在W基板上的潤(rùn)濕行為和Fe元素對(duì)Cu/W界面結(jié)合狀態(tài)的影響。借助SEM、EMPA和XRD分析添加Fe元素對(duì)Cu/W界面微觀結(jié)構(gòu)和界面結(jié)合機(jī)制的影響。結(jié)果表明：添加Fe有利于降低Cu/W間的接觸角；且其潤(rùn)濕角隨溫度升高而降低。與在真空條件下相比，在Ar氣氣氛中，添加Fe能較大幅度地減小Cu/W間的接觸角，當(dāng)Fe的添加量為1.2%(質(zhì)量分?jǐn)?shù))時(shí)，在1 300 ℃接觸角由107.5˚下降到47.5˚；Cu/W界面形成1~2 μm的合金過(guò)渡層，平直的Cu/W界面變成鋸齒狀，且隨著升高溫度，界面處Cu、Fe和W元素間的擴(kuò)散與溶解程度加強(qiáng)，F(xiàn)e原子充分地?cái)U(kuò)散到界面兩側(cè)的Cu和W中，界面附近沒(méi)有新相生成；Cu/W界面結(jié)合機(jī)制由最初的機(jī)械結(jié)合轉(zhuǎn)變?yōu)閿U(kuò)散與溶解型的冶金結(jié)合。
關(guān)鍵字: 座滴法；潤(rùn)濕性；接觸角；Fe；Cu/W界面
（School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China）
Abstract:By the sessile drop technique, the wetting behaviors of Cu-Fe alloys on W matrixes in the vacuum and Ar atmosphere, and the effect of Fe addition on the bonding conditions of Cu/W interface were studied respectively. SEM, EPMA and X-ray diffraction were used to analyze the microstructure and bonding mechanism of the Cu/W interface with the addition of Fe element. The results show that the wetting angle of Cu on W substrates decreases with increasing content of Fe in liquid Cu, and the wetting angle also decreases with increasing wetting temperature. Compared with the experimental results in the vacuum, the wetting angle decreases dramatically with increasing content of Fe in Ar atmosphere, and the contact angle between molten Cu and W substrate decreases from 107.5˚ to 47.5˚ while the content of Fe is up to 1.2% (mass fraction) at 1 300 ℃. There is an alloying transition layer with a thickness 1−2 μm at the Cu/W interface, and the straight interface of Cu/W system is turned into serrate interface. With increasing wetting temperature, the mutual diffusion and dissolution of Cu, Fe, and W atoms are much more intense, the Fe atoms are diffused and dissolved into the W and Cu matrixes, and there is no new reactive phase on the CuFe/W interface. The bonding mechanism of Cu/W interface is transformed from the initial mechanical bond into the metallurgical bond by means of mutual diffusion and dissolution.
Key words: sessile drop technique; wettability; contact angles; Fe; Cu/W interface
