(大連理工大學(xué) 三束材料改性國(guó)家重點(diǎn)實(shí)驗(yàn)室，材料科學(xué)與工程學(xué)院，大連 116024)
摘 要:
關(guān)鍵字: 無(wú)氰電鍍；鍍金；Au凸點(diǎn)；電流密度；生長(zhǎng)行為
（State Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China）
Abstract: The effect of current density (J) on the growth behavior of Au bumps in a stable non-cyanide gold electrolyte containing NaAuCl4∙2H2O was investigated under 80 ℃, pH 8.0. While J was in the range of 0.5~2.5 A/dm2, the higher the J was, the faster the Au bumps growth rate was. The results show that when J=0.5~1.0 A/dm2, the Au bumps have fine grains, high density and smooth surface. While J =1.5~2.5 A/dm2, the surface of the Au bumps becomes coarsing with increasing J value, whereas the density of the bumps keeps decreasing. Dendrites are clearly observed when J=2.0 A/dm2, and they become pronounced when J=2.5 A/dm2. Through the experiments, J=1.0 A/dm2 is chosen to electroplate Au bumps, under which a linear relationship exists between the average thickness of Au bumps and the electroplating time. Au bumps with regular shape and high adhesive strength with the Si substrate are obtained.
Key words: non-cyanide electroplating; Au electroplating; Au bump; current density; growth behavior
