(1. 福州大學(xué) 機(jī)械工程及自動(dòng)化學(xué)院，福州 350108；2. 福州大學(xué) 材料研究所, 福州 350002)
摘 要:
關(guān)鍵字: 浸鍍銀；電沉積；置換反應(yīng)
（1. College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China;2. Institute for Materials Research, Fuzhou University, Fuzhou 350002, China）
Abstract: The deposition rate and morphology of immersion silver plating onto copper substrate in silver nitrate aqueous solution were studied by galvanic current method and field emission scanning electron microscopy (FE-SEM). The results show that the whole deposition process can be divided into three stages：extending growth，transitional growth and dendritic growth. The deposition rate and morphology of Ag deposit are all different in each stage. Initially，the adhesive Ag atoms grow along the lattice of copper substrate. Secondly，the substrate is spread with initial silver crystal accompanied with two-dimension growth. Finally，coarse and sponge-like silver plating is prepared with dendritic growth.
Key words: immersion silver; electrodeposition; displacement
