(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083))
摘 要:
關(guān)鍵字: 低溫?zé)Y(jié)型銀漿料；線膨脹系數(shù)； 熱導(dǎo)率；剪切力
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract: The composition, preparation and sintering curve of a low-temperature sintered Ag/glass paste were studied. The effects of composition of paste on the microstructure, thermal conductivity, coefficient of thermal expansion (CTE) and shear force were studied. The theoretical models were employed to calculate the CTE and thermal conductivity of Ag/class. The influence factors on the coefficient of thermal expansion and thermal conductivity were analyzed. The results show that the CTE and thermal conductivity of composite decrease apparently with increasing glass content. When the ratio of silver to glass frits is 7׃3 and the ratio of solid powder to organic vehicles is 8׃2, the semiconductor chip assembly can satisfy the demand of CTE and thermal conductivity, and the optimal shear force can also be obtained.
Key words: low-temperature sintered Ag/glass paste; coefficient of thermal expansion; thermal conductivity; shear force
