(江蘇大學(xué) 材料科學(xué)與工程學(xué)院，鎮(zhèn)江 212013)
摘 要:
關(guān)鍵字: 銅/鋁復(fù)合材料；界面；結(jié)合機(jī)理
（School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China）
Abstract:Cu/Al compound materials were fabricated by solid-liquid bonding method, and then the microstructures and bonding properties of Cu/Al interfaces were studied. According to the analysis of the effects of the processing parameters on Cu/Al interfaces, the bonding process was optimized. The results show that the well-bonded interface with a transition layer of about 45 μm in thickness and a shear strength of 57 MPa can be obtained as the Cu plate pre-treated in a mix solution is preheated at 400 ℃ and the pouring temperature is 700 ℃. From further study, it is indicated that the bonding of the Cu/Al interface is carried out by the melting of copper and its diffusion in aluminum.
Key words: Cu/Al compound materials; interface; bonding mechanism
