Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報

ZHONGGUO YOUSEJINSHU XUEBAO

第18卷    第5期    總第110期    2008年5月

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文章編號:1004-0609(2008)05-0845-06
稀土元素在Cu-12%Ag合金中形成的化合物及對合金退火性能的影響
劉嘉斌1,張 雷2,孟 亮1

(1. 浙江大學(xué) 材料科學(xué)與工程系,杭州 310027;2. 北京科技大學(xué) 材料科學(xué)與工程學(xué)院,北京 100083)

摘 要: 采用冷拉拔結(jié)合中間熱處理制備纖維復(fù)合Cu-12%AgCu-12%Ag-0.3%RE合金,在不同溫度對合金進行退火,分析合金中稀土化合物形態(tài)與結(jié)構(gòu),研究合金組織性能在退火過程中的變化規(guī)律稀土元素的作用。結(jié)果表明:合金中初生富Cu枝晶及共晶體在拉拔過程中形成纖維復(fù)合組織,并在500 退火演變?yōu)榈容S晶粒;隨退火溫度升高,合金強度下降而其電導(dǎo)率升高;添加0.3%的稀土元素能夠在Cu-12%Ag合金中形成(Cu, Ag)6(Ce, La)化合物粒子,并可提高300 以下退火合金的抗軟化能力,但使合金的電導(dǎo)率略為下降;(Cu, Ag)6(Ce, La)化合物粒子在拉拔過程中基本不變形,也不明顯影響纖維組織退火時的再結(jié)晶行為。

 

關(guān)鍵字: 銅合金;稀土元素;退火;顯微組織;強度;電導(dǎo)率

Effects of rare earth additions on compound structure and as-annealed properties of Cu-12%Ag
LIU Jia-bin1, ZHANG Lei2, MENG Liang1

1. Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; 2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China

Abstract:Cu-12%Ag and Cu-12%Ag-0.3%RE alloys were manufactured by cold drawing combined with intermediate heat treatments. The drawn alloys were annealed at different temperatures. The morphology and structure of the compound particles in Cu-12%Ag-0.3%RE were examined. The changes of the microstructure and properties with annealing temperature and the effect of rare earth additions were investigated. The results show that the primary Cu-rich dendrites and eutectic colonies in the alloys evolve into filamentary structure during the drawing deformation. The filamentary structure changes into recrystallization structure of equiaxed grains during annealing at 500 ℃. The strength of the alloy decreases whereas the conductivity increases with increasing annealing temperature. Adding 0.3% rare earth elements into Cu-12%Ag alloys (Cu, Ag)6(Ce, La) compound particles form and the softening resistance in annealing are increased at temperatures lower than 300 ℃, whereas the conductivity are slightly decreased. The compound particles are hardly deformed during the drawing process and hardly influence the recrystallizaion behavior of the filamentary structure during the annealing process.

 

Key words: Cu alloy; rare earth element; annealing; microstructure; strength; electrical conductivity

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會 主辦:中國有色金屬學(xué)會 承辦:中南大學(xué)
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