(1. 西安理工大學(xué) 材料科學(xué)與工程學(xué)院，西安 710048；
2. 上海理工大學(xué) 機械工程學(xué)院，上海 200093；
3. 河南科技大學(xué) 材料科學(xué)與工程學(xué)院，洛陽 471003)
摘 要:
關(guān)鍵字: Cu-2.0Ni-0.5Si-0.03P合金；熱壓縮變形；動態(tài)再結(jié)晶；本構(gòu)方程
JIA Shu-guo3, REN Feng-zhang3, LONG Yong-qiang3
（1. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China;
2. College of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China;
3. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China）
Abstract:The flow stress behavior of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression deformation was studied by isothermal compression test at Gleeble−1500D thermal-mechanical simulator at the temperature ranging from 600 ℃ to 800 ℃ and at the strain rate from 0.01 /s to 5 /s. The results show that the flow stress is controlled by both strain rate and deforming temperature, the flow stress decreases with increasing deforming temperature, while increases with increasing strain rate. When the deformation temperature is 750 and 800 ℃, the flow stress decreases after a peak value, showing continuous dynamic recrystallization. Both the hot deformation activation energy and constitutive equation were derived from the correlativity of flow stress, strain rate and temperature.
Key words: Cu-2.0Ni-0.5Si-0.03P alloy; hot compression deformation; dynamic recrystallization; constitutive equation
