(中南大學(xué) 材料科學(xué)與工程學(xué)院，長(zhǎng)沙 410083)
摘 要: 選擇成分(質(zhì)量分?jǐn)?shù)，%)為Au-20.1Ag-2.5Si-2.5Ge的中溫釬料合金，采用中頻感應(yīng)真空熔煉法制備釬料合金鑄錠，分別利用DTA、SEM對(duì)釬料合金的熔點(diǎn)及顯微組織進(jìn)行分析，并初步研究釬料與Ni的潤(rùn)濕性。結(jié)果表明，釬料合金的熔化溫度區(qū)間為451.36~506.49 ℃；釬料合金形成了α+β共晶組織，由于Si、Ge同時(shí)加入，共晶組織變質(zhì)為細(xì)小分散的共晶體；釬料合金具備優(yōu)良的可加工性以及與Ni具有良好的潤(rùn)濕性，且在焊接界面釬料合金已與Ni合金化形成金屬間化合物。
關(guān)鍵字: Au-20.1Ag-2.5Si-2.5Ge；中溫釬料；潤(rùn)濕性；焊接界面
medium-temperature solder
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:Au-20.1Ag-2.5Si-2.5Ge (mass fraction, %) medium-temperature solder was selected to prepare the casting alloy by the vacuum medium-frequency induction melting method, the melting point and the microstructure were studied by DTA and SEM, and the wettability of the solder alloy with Ni was tested tentatively. The results show that, the melting temperature of the solder alloy is in the range of 451.36−506.49 ℃; α+β eutectic structures form in the solder alloy; because of the addition of Si and Ge, the eutectic structures are modified to be much finer and dispersive structures; the solder alloy has good machinability and good wettability with Ni, the solder alloy is alloyed with Ni by forming intermetalics in the welding interface.
Key words: Au-20.1Ag-2.5Si-2.5Ge; medium-temperature solder; wettability; welding interface
