Abstract:The indentation process of aluminum film/silicon substrate combination by a rigid spherical indenter has been simulated using finite element method (FEM). It is demonstrated that both the yield strength and hardening index of the film affect the load displacement curve. An empirical relationship among the strength parameters and hardness of the film has been established from the FEM results. Utilizing the relationship and the hardness measured by nanoindentation test for two different indentation depths, the yield strength and plastic hardening index of the film can be estimated.

Key words: nanoindentation method thin metal film mechanical properties finite element method