中國有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 10 No. 4 August 2000 |
WU Chun-jing(吳春京)4, WANG Xin-hua(王新華)1, HU Han-qi(胡漢起)4
（1. School of Metallurgy, University of Science and Technology Beijing, Beijing 100083, P.R.China;
2. Liaoning Institute of Technology, Jinzhou 12001, P.R.China;
3. Guangzhou Nonferrous Metals Institute, Guangzhou 510651, P.R.China;
4. School of Materials Science and Engineering, University of Science and Technology Beijing,
Beijing 100083, P.R.China）
Abstract:Based on theoretical analyses, the effect of electric current density on stability of solidification interface morphology of QAl-4 alloy was studied experimentally. The results show that the experimental results agree well with the theoretical analyses, and the following conclusions can be drawn: the increase of electric current density improves the stability of the solidification interface morphology under the condition of no convection of the liquid metal. Otherwise this convection will slow down the trend of solidification interface developing to stability caused by increasing electric current density.
Key words: Cu-Al alloy; unidirectional solidification; interface; morphology; stability
