中國有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 20 No. 3 March 2010 |
CHEN Yan(陳 燕)2, YU Sheng-lin(禹勝林)1,3,
（1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics,
Nanjing 210016, China;
2. Harbin Welding Institute, Harbin 150080, China;
3. The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China）
Abstract:Extensive testing was carried out to study the effects of rare earth Ce doping on the properties of SnAgCu solder alloys. The addition of 0.03% (mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties, but slightly lower its melting temperature. The tensile creep behavior of bulk SnAgCuCe solders was reported and compared with SnAgCu solders. It is found that SnAgCuCe solders show higher creep resistance than SnAgCu alloys. Moreover, Dorn model and Garofalo model are successfully used to describe the creep behavior of SnAgCu and SnAgCuCe alloys. The parameters of the two creep constitutive equations for SnAgCu and SnAgCuCe solders are determined from separated constitutive relations and experimental results. Nonlinear least-squares fitting is selected to determine the model constants. The experimental data of the stress—creep strain rate curves are in good agreement with the theoretical ones.
Key words: rare earth Ce; SnAgCu solder; creep behavior; constitutive equations
