Abstract:The deformation mechanisms in a wide temperature range from room temperature to 1200K were investigated by thermal activation approach. Using observed instantaneous stress response to the strain rate jump (Δσ_tr), the activation volume V_a, then the activation enthalpy ΔH, activation free enthalpy ΔG and activation entropy ΔS were calculated. The apparent activation energy of high temperature deformation is estimated to be 3.66eV, which is larger than the self-diffusion coefficient of binary TiAl (3.01eV). The dislocations at 1173K are generally curved or bowed, even helical-shaped dislocations. The climb of ordinary dislocations as well as twinning has greatly contributed to the plastic deformation. The CRSS at 1173K is estimated to be 180MPa. The higher resisting stress at both room temperature and elevated temperature might relate to the high Nb content of the alloy.

Key words:   TiAl; thermal activation approach; deformation mechanisms