中國有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 11 No. 4 August 2001 |
response of surface mounted solder joints
under different temperature cycling
（1. National Key Laboratory of Welding,
Harbin Institute of Technology,Harbin 150001, P.R.China；
2. Research and Analysis Center, Electronic Product Reliability and
Environmental Testing Research Institute, Guangzhou 510610, P.R.China；
3. Department of Mechanical Engineering, Hiroshima University,
HigashiHiroshima 739, Japan）
Abstract:Nonlinear finite element simulation for mechanical response of surface mounted solder joint under different temperature cycling was carried out. Seven sets of parameters were used in order to evaluate the influence of temperature cycling profile parameters. The results show that temperature cycling history has significant effect on the stress response of the solder joint. Based on the concept of relative damage stress proposed by the authors, it is found that enough high temperature holding time is necessary for designing the temperature cycling profile in accelerated thermal fatigue test.
Key words: finite element simulation; surface mounted solder joint; thermal cycling; mechanical response
