Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學(xué)報(bào)(英文版)

Transactions of Nonferrous Metals Society of China

Vol. 19    No. 4    August 2009

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Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy
In-Joon SON1, Hiroaki NAKANO2, Satoshi OUE2, Shigeo KOBAYASHI3, Hisaaki FUKUSHIMA2, Zenji HORITA2

1. Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka, 819-0395, Japan;
2. Department of Materials Science and Engineering, Faculty of Engineering, Kyushu University,
744 Motooka, Nishi-ku, Fukuoka, 819-0395, Japan;
3. Department of Applied Chemistry and Biochemistry, Faculty of Engineering, Kyushu Sangyo University,
2-3-1 Matsukadai, Higashi-ku, Fukuoka, 813-8503, Japan

Abstract:The effect of equal-channel angular pressing(ECAP) on the pitting corrosion resistance of anodized Al-Cu alloy was investigated by electrochemical techniques in a solution containing 0.2 mol/L AlCl3 and also by surface analysis. Anodizing was conducted for 20 min at 200 and 400 A/m2 in a solution containing 1.53 mol/L H2SO4 and 0.018 5 mol/L Al2(SO4)3∙16H2O at 20 ℃. Anodized Al-Cu alloy was immediately dipped in boiling water for 20 min to seal the micro pores present in anodic oxide films. The time required before initiating pitting corrosion of anodized Al-Cu alloy is longer with ECAP than without, indicating that ECAP process improves the pitting corrosion resistance of anodized Al-Cu alloy. Second phase precipitates such as Si, Al-Cu-Mg and   Al-Cu-Si-Fe-Mn intermetallic compounds are present in Al-Cu alloy and the size of these precipitates is greatly decreased by application of ECAP. Al-Cu-Mg intermetallic compounds are dissolved during anodization, whereas the precipitates composed of Si and Al-Cu-Si-Fe-Mn remain in anodic oxide films due to their more noble corrosion potential than Al. FE-SEM and EPMA observation reveal that the pitting corrosion of anodized Al-Cu alloy occurs preferentially around Al-Cu-Si-Fe-Mn intermetallic compounds, since the anodic oxide films are absent at the boundary between the normal oxide films and these impurity precipitates. The improvement of pitting corrosion resistance of anodized Al-Cu alloy processed by ECAP appears to be attributed to a decrease in the size of precipitates, which act as origins of pitting corrosion.

 

Key words: aluminum-copper alloy; equal-channel angular pressing; anodizing; pitting corrosion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學(xué)技術(shù)協(xié)會(huì) 主辦:中國有色金屬學(xué)會(huì) 承辦:中南大學(xué)
湘ICP備09001153號(hào) 版權(quán)所有:《中國有色金屬學(xué)報(bào)》編輯部
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