中國有色金屬學報(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 18 No. 5 October 2008 |
FANG Zheng(方 正)3 , TAN Jian-xi(譚建錫)1, 2, YANG Peng(楊 鵬)1, 2
（1. Key Laboratory of Biometallurgy, Ministry of Education, Central South University, Changsha 410083, China;
2. School of Minerals Processing and Bioengineering, Central South University, Changsha 410083, China;
3. School of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China）
Abstract:As thiourea and sulfur-containing mixed additives contaminate cathodic copper, inhibition behavior of some new mixed additives such as gelatin+hexadecylpyridinium bromide (HDPBr), gelatin+polyethylene glycol(PEG), gelatin+polyacryl amide (PAM), gelatin+PEG+cetyl-tri-methyl ammonium bromide (CTABr) and gelatin+PAM+CTABr was investigated by cyclic voltammetry as well as cathodic polarization in order to improve the quality of cathodic copper in bio-metallurgical process. The results indicate that the inhibition performances of these additives are dependent on complex and adsorption behaviors as well as the deposit potential. For a solution of acidic copper sulpate containing 40 g/L Cu2+ and 180 g/L H2SO4, the additive (gelatin+HDPBr) is the most efficient among the investigated additives because HDPBr with a large organic cation and π electron can adsorb on the cathodic surface to block the active sites and Br− ion can precipitate Cu2+ to form Cu2Br2. The additive (gelatin+PAM) also has a better inhibition performance, while the additives (gelatin+PEG), (gelatin+PEG+CTABr) and (gelatin+PAM+CTABr) are comparatively lower inhibition performance compared with the additive (gelatin+thiourea) which has been frequently used so far.
Key words: copper electrowinning; mixed additives; hexadecylpyridinium bromide; polyethylene glycol; polyacryl amide; cetyl- tri-methyl ammonium bromide
