中國(guó)有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 18 No. 3 June 2008 |
（Department of Electronics Packaging Technology, School of Materials Science and Engineering,Harbin Institute of Technology, Harbin 150001, China）
Abstract:To restrain the formation of AuSnx intermetallic components (IMCs) in solder joints, Zn was added into Sn-rich solders. The solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125 ℃. The results show that the total thickness of AuSnx IMCs at the interface of pure Sn solder and Au foils reaches about 54 μm under the condition of 600 h aging. In Sn-1.5Zn solder joints, however, formation of AuSn4 IMCs is restrained greatly. As the content of Zn in the solder is increased to 3.5%(mass fraction), no AuSn4 IMC is observed at the interface. Au-Zn phases form beside AuSn2 and AuSn IMCs layers. As for Sn-9.0Zn solder joints, Au-Zn and Au-Zn-Sn phases and few AuSnx IMCs form at the interface. Moreover, total thickness of the phases and IMCs is far less than that of AuSnx IMCs in the pure Sn solder joints.
Key words: Zn addition; interfacial reaction; intermetallic compounds
